Siirry sisältöön

Leica EM TXP cross-sectioning device

Versatile and easy specimen pre-preparation

Leica EM TXP is a mechanical precision cross-sectioning system designed to reduce specimen size for visual inspection. It helps minimize ion beam milling time and enables the preparation of mirror-like surfaces.

Precise pre-trimming reveals structures within the specimen and removes unwanted material. EM TXP allows direct targeting of the region of interest while enabling accurate positioning of tools and adjustment of tilt angles.

EM TXP can mill, cut, grind and polish specimens. Specimens do not require epoxy embedding, as specimen holders can be used throughout the preparation workflow. Maintaining consistent specimen orientation and fixation during the entire preparation process reduces the risk of specimen damage and misalignment.

Features

  • Versatile mechanical specimen processing
  • Positioning using a stereomicroscope
  • Precise localization and preparation of microscopic features
  • Automatic process control for preparing mirror-like surfaces
  • Adjustable LED ring light intensity and selectable illumination segments

Product is available in the following countries:

  • Finland

Links and documents

Manufacturer’s product page

Keywords

cross-sectioning